Packaging allows electronic devices and systems to be contained in a safe working environment, reducing or eliminating unwanted disturbances while remaining connected to the outside world.

We focus on the packaging needs of a variety of radiation detectors. To support these needs, we have curated the ability to:

• Design appropriate packaging material, such as circuit boards.
• Form arrays of micro-bumps to prepare devices for flip-chip bonding.
• Complete flip-chip bonding of arrays.
• Perform die-attach with a micron-level accuracy.
• Make point-to-point connections with wire bonding.
• Carry out inspection and testing for small to medium volume production runs.

Our capabilities are flexible to support the broad range of products we deliver. More than likely, they will already support your packaging needs or can be made to do so with minimal development.